Composites / Internal Mold Releases / Epoxy

Typical Loading Level of MoldWiz® Internal Mold Release in epoxy resin, is 0.5% – 1.5%, (5-15g/kg resin) based on resin weight, and depending on the type of molding process. Resin formulations with higher filler loading generally require higher loadings of internal release.

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Solutions for Composites: Internal Mold Releases

 

Brand Cure Type / Group Classification Product Number Typical Application /Comments
MoldWiz® Aliphatic amines Example: DETA INT-1846N2 Neutralized to prevent acceleration of cure
MoldWiz® Phenolics & Aliphatic amines INT-1850HT For higher temperature processing >350°F/175°C
MoldWiz® Aromatic amines, MDA & non-MDA based INT-1888LE Medium-High temperature cures >450°F/230°C
MoldWiz® Aromatic amines, MDA & non-MDA based INT-1857DC Medium-High temperature cures >450°F/230°C
MoldWiz® Acid anhydride Example: phthalic anhydide INT-1890M Pultrusion and other processes
MoldWiz® Acid anhydride Example: phthalic anhydide INT-1888LE Pultrusion and other processes
MoldWiz® Acid anhydride, w/ tertiary amine or immidazole Example: MTHPA INT-1888LE High temperature cures >350°F/175°C; pultrusion
MoldWiz® Acid anhydride, w/ tertiary amine or immidazole Example: MTHPA INT-1846N2 High temperature cures >350°F/175°C; pultrusion
MoldWiz® DICY (immidazole accelerated) INT-1324B Pre-preg or wet systems
MoldWiz® DICY (immidazole accelerated) INT-1888LE Pre-preg or wet systems