Typical Loading Level of MoldWiz® Internal Mold Release in epoxy resin is 0.5% – 1.5%, (5-15g/kg resin) based on resin weight, and depending on the type of molding process. Resin formulations with higher filler loading generally require higher loadings of internal release.
Download the brochure: Solutions for Epoxy
| Brand | Cure Type / Group Classification | Product Number | Typical Application /Comments |
|---|---|---|---|
| MoldWiz® | Aliphatic amines Example: DETA | INT-1846N2 | Neutralized to prevent acceleration of cure |
| MoldWiz® | Phenolics & Aliphatic amines | INT-1850HT | For higher temperature processing >350°F/175°C |
| MoldWiz® | Aromatic amines, MDA & non-MDA based | INT-1888LE | Medium-High temperature cures >450°F/230°C |
| MoldWiz® | Aromatic amines, MDA & non-MDA based | INT-1857DC | Medium-High temperature cures >450°F/230°C |
| MoldWiz® | Acid anhydride Example: phthalic anhydide | INT-1890M | Pultrusion and other processes |
| MoldWiz® | Acid anhydride Example: phthalic anhydide | INT-1888LE | Pultrusion and other processes |
| MoldWiz® | Acid anhydride, w/ tertiary amine or immidazole Example: MTHPA | INT-1888LE | High temperature cures >350°F/175°C; pultrusion |
| MoldWiz® | Acid anhydride, w/ tertiary amine or immidazole Example: MTHPA | INT-1846N2 | High temperature cures >350°F/175°C; pultrusion |
| MoldWiz® | DICY (immidazole accelerated) | INT-1324B | Pre-preg or wet systems |
| MoldWiz® | DICY (immidazole accelerated) | INT-1888LE | Pre-preg or wet systems |